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NXP’s UWB technology enables secure ranging and precision sensing adding spatial context to wireless devices. Processing contextual information such as position, movement and distance enables decision making to take place with high granularity.

Taiwan’s Yageo Corporation is set to acquire its U.S. competitor KEMET Corp in $1.8 billion deal with a goal of expanding its global footprint.

The existing multi-layer ceramic chip capacitors (MLCCs) market is, well, multilayered. Even though MLCCs have been around since the early 1960s, they’re still considered an emerging technology, given the tremendous advancements in memory, performance, and durability on an annual basis.

Pancon Corporation today announced that it will close two manufacturing plants in North America. Its' two sites located in East Taunton, Massachusetts and Temecula, California, will be shuttered within the next 90-days effecting a total of 102 associates.

For harsh environments involving conditions such as dust, moisture, shock, vibration, or extreme temperatures, a more rugged, specialized kind of connector is needed to maintain high-speed data transfer. Fortunately, there are many different options available to meet these stringent requirements.

Seemingly endless challenges are a given in the global marketplace. But over the past few years, significant efficiency barriers have made e-procurement specialists, engineers, designers, and everyone else rethink “normal” parts supply-and-demand principles.

From unexpected robotics investment to strong semiconductor growth in East Asia, September was a benchmark month for IoT device production and associated electronic components. Here a few noteworthy developments for sourcing professionals to monitor in the coming weeks and months.

Modules ease design of Bluetooth 5 wireless solutions for space-constrained IoT applications Raytac’s ‘MDBT42V modules’ employ Nordic’s nRF52832 WL-CSP SoC to deliver reliable long-range wireless connectivity and good RF performance in a compact form factor.

ON Semiconductor Wide Bandgap Silicon Carbide (SiC) Devices incorporate a completely new technology that provides superior switching performance and higher reliability compared to silicon. The system benefits include the highest efficiency, faster-operating frequency, increased power density, reduced EMI, and reduced system size and cost.

Moore’s Law, which states that the number of transistors in an integrated circuit doubles every two years has pretty much held up since the early 1970s. At that time, there were up to 5,000 transistors in advanced integrated circuits. Today, that figure is roughly 50 billion. At some point, designers and engineers wondered, “Wouldn’t physical space limits eventually make Moore’s Law obsolete?”