Sourcengine Team
Huawei establishing first chip manufacturing facility in China, production to start in 2022
Huawei is reportedly working to establish its first chip factory in Wuhan, China. The fab is on schedule to begin producing optical communications components and modules in 2022.
Apple and Intel to release new products with TSMC’s 3nm manufacturing process
Apple and Intel are reportedly working with TSMC with an eye toward using its 3nm node to make their forthcoming products. The foundry's next-generation manufacturing process offers double-digit upgrades on its current 5nm node.
NXP Semiconductors and Jio Platforms teaming up to expand 5G coverage in India
NXP Semiconductors revealed it is collaborating with Jio Platforms to expand the functionality of India’s 5G infrastructure. It also reportedly partnered with a leading foundry to reinforce its supply chain.
GlobalFoundries begins construction on $4B 300mm wafer fab in Singapore
GlobalFoundries, the world’s fourth-biggest contract chipmaker, announced it broke ground on a $4 billion fab. The Singaporean facility will make 450,000 silicon wafers (300mm) per month by 2023
Nexperia investing $700M in capacity expansion, opens new production line in Britain
Nexperia is investing $700 million to expand its manufacturing and development capability. In addition, the firm launched a new production line in Manchester, England to address the global chip shortage.
Nvidia to acquire DeepMap, an advanced mapping startup, to boost its AV resources
Nvidia announced plans to acquire the Silicon Valley startup called DeepMap in Q3 2021. The transaction will help the chipmaker bring its popular autonomous automobile technology to another level.
Taiwanese semiconductor industry grappling with surge in local COVID-19 cases
Since April, Taiwan has been dealing with a major surge in coronavirus infections. Recently, the new COVID-19 wave has been causing disruptions among the island’s many semiconductor manufacturers, a development with potentially global implications.
TSMC and Japanese government launching $337M 3D chip development project
TSMC and the Japanese government are co-funding a $337.4 million semiconductor research and development project. The initiative aims to create potentially revolutionary 3DIC manufacturing technologies.
Samsung activating new production line to help mitigate global chip shortage
Samsung recently revealed it would establish a new 5nm production line in its Pyeongtaek, South Korea fab to address the global chip crisis. It also made a deal to develop next-generation automotive semiconductors with Hyundai.
Qualcomm reportedly inks six-year foundry services agreement with UMC
Qualcomm reportedly inked a six-year foundry services agreement with United Microelectronics Corporation (UMC), a Taiwanese contract chipmaker, to bolster its supply chain. However, the deal might create long-term problems for small and midsized OEMs.