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In today’s hyper-connected marketplace, manufacturers need components that can sustain high levels of bandwidth with an absolute minimum of lag. Accordingly, Micron Technology developed its second-generation common input/output reduced-latency dynamic random access memory (CIO RLDRAM 2) chips. By implementing the memory device in their systems, developers can benefit from better than DDR3 performance with the ease of use of an SRAM-like interface.

When establishing and maintaining data and signal networks, it’s essential to utilize components that are easy to use. That quality is even more critical when it comes to communications gear deployed in harsh or remote areas. Accordingly, networking administrators would do well to invest in the M12 Push-Pull Connectors made by Phoenix Contact.